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RT9173ACS Datasheet(PDF) 7 Page - Richtek Technology Corporation |
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RT9173ACS Datasheet(HTML) 7 Page - Richtek Technology Corporation |
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7 / 10 page  RT9173/A DS9173/A-06 March 2002 www.richtek-ic.com.tw 7 Fig. 6 Layout Consideration To prevent this maximum junction temperature from being exceeded, the appropriate power plane heat sink MUST be used. Higher continuous currents or ambient temperature require additional heatsinking. RT9173CS (SOP-8) The PCB heat sink copper area should be solder-painted without masked. This approaches a “best case” pad heat sink. Use vias to conduct the heat into the buried or backside of PCB layer . RT9173CS (SOP-8) The PCB heat sink copper area should be solder-painted without masked. This approaches a “best case” pad heat sink. Use vias to conduct the heat into the buried or backside of PCB layer . |
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