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MNDS90C032-X-RH Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. MNDS90C032-X-RH
Description  LVDS Quad CMOS Differential Line Receiver
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

MNDS90C032-X-RH Datasheet(HTML) 5 Page - National Semiconductor (TI)

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MNDS90C032-X-RH REV 1B1
MICROCIRCUIT DATA SHEET
Electrical Characteristics
AC PARAMETERS: (SEE NOTE 4)
(The following conditions apply to all the following parameters, unless otherwise specified.)
AC:
VCC = 4.5V/5.0V/5.5V, CL = 20pF
SYMBOL
PARAMETER
CONDITIONS
NOTES
PIN-
NAME
MIN
MAX
UNIT
SUB-
GROUPS
tPHLD
Differential
Propagation Delay
High to Low
Vid = 200mV, Input pulse = 1.1V to
1.3V, Vin = 1.2V (0 differential) to
Vout = 1/2 Vcc
1.0
8
ns
9, 10,
11
tPLHD
Differential
Propagation Delay
Low to High
Vid = 200mV, Input pulse = 1.1V to
1.3V, Vin = 1.2V (0V differential) to
Vout = 1/2 Vcc
1.0
8
ns
9, 10,
11
tSKD
Differential Skew
|tPHLD-tPLHD|
CL = 20pF, Vid = 200mV
3
ns
9, 10,
11
tSK1
Channel to
Channel Skew
CL = 20pF, Vid = 200mV
2
3
ns
9, 10,
11
tSK2
Chip to Chip Skew
CL = 20pF, Vid = 200mV
3
7
ns
9, 10,
11
tPLZ
Disable Time Low
to Z
Input pulse = 0V to 3.0V,
Vin = 1.5V,
Vout = Vol+0.5V, Rload = 1k Ohm to VCC
20
ns
9, 10,
11
tPHZ
Disable Time High
to Z
Input pulse = 0V to 3.0V,
Vin = 1.5V,
Vout = Voh-0.5V, Rload = 1k Ohm to GND
20
ns
9, 10,
11
tPZH
Enable Time Z to
High
Input pulse = 0V to 3.0V,
Vin = 1.5V,
Vout = 50%, Rload = 1k Ohm to GND
20
ns
9, 10,
11
tPZL
Enable Time Z to
Low
Input pulse = 0V to 3.0V,
Vin = 1.5V,
Vout = 50%, Rload = 1k Ohm to VCC
20
ns
9, 10,
11
AC/DC PARAMETERS: POST RADIATION LIMITS (SEE NOTE 4)
Icc
No Load Supply
Current
EN, EN* = Vcc or GND, Inputs Open
20
mA
1
EN, EN* = 2.4 or 0.5, Inputs Open
20
mA
1
Iccz
No Load Supply
Current Receivers
Disabled
EN = GND, EN* = Vcc, Inputs Open
20
mA
1
Note 1:
Tested during VOH/VOL tests.
Note 2:
Channel to Channel Skew is defined as the difference between the propagation delay of
one channel and that of the others on the same chip with an event on the inputs.
Note 3:
Chip to Chip Skew is defined as the difference between the minimum and maximum
specified differential propagation delays.
Note 4:
Pre and post irradiaton limits are identical to those listed under AC and DC
electrical characteristics except as listed in the Post Radiation Limits Table (IF
APPLICABLE). Radiation end point limits for the noted parameters are guaranteed only
for the conditions as specified.
5


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