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N74F862N Datasheet(PDF) 2 Page - NXP Semiconductors

Part # N74F862N
Description  Bus transceivers 3-State
Download  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

N74F862N Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74F862, 74F863
Bus transceivers (3-State)
2
2000 Mar 24
853-0881 23378
FEATURES
Provide high performance bus interface buffering for wide
data/address paths or buses carrying parity
High impedance NPN base inputs for reduced loading (20µA in
High and Low states)
I
IL is 20µA vs. 1000µA for AM29861 series
Buffered control inputs for light loading, or increased fan-in as
required with MOS microprocessors
Positive and negative over-shoots are clamped to ground
3-State outputs glitch free during power-up and power-down
Slim dual In-line (DIP) 300mil package
Broadside pinout compatible with AMD AM29862–29863
Outputs sink 64mA
DESCRIPTION
The 74F862 and 74F863 bus transceivers provide high performance
bus interface buffering for wide data/address paths of buses carrying
parity. The 74F863 9-bit bus transceiver has NOR-ed transmit and
receive output enables for maximum control flexibility.
TYPE
TYPICAL
PROPAGATION
DELAY
TYPICAL SUPPLY
CURRENT
(TOTAL)
74F862
6.0ns
150mA
74F863
6.0ns
115mA
ORDERING INFORMATION
PACKAGES
COMMERCIAL RANGE
VCC = 5V±10%;
Ta = 0°C to +70°C
PKG DWG #
24-pin Plastic Slim
Dual In-line (300mil)
Package
N74F862N, N74F863N
SOT222-1
24-pin Plastic Small
Outline Large1
N74F862D, N74F863D
SOT137-1
NOTE:
1. Thermal mounting techniques are recommended. See SMD
Process Applications for a discussion of thermal considerations for
surface mounted devices.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
18
24
OEAB
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
VCC
13
23
22
21
20
19
17
16
15
14
TOP VIEW
OEBA
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
GND
SF00518


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