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SIO1049 Datasheet(PDF) 6 Page - Microsemi Corporation

Part No. SIO1049
Description  Super I/O with LPC Interface, with IrDA and Microsoft Windows MCE Consumer IR Support
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Maker  MICROSEMI [Microsemi Corporation]
Homepage  http://www.microsemi.com
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Super I/O with LPC Interface, with IrDA and Microsoft® Windows® MCE Consumer IR Support
Revision 0.35 (05-17-06)
6
SMSC SIO1049
PRODUCT PREVIEW
Package Outline
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane
H.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 3 64 Pin STQFP Package Outline, 7X7X1.4 Body, 2 MM Footprint
Table 1 64 Pin STQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.60
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
1.35
1.40
1.45
Body Thickness
D
8.80
9.00
9.20
X Span
D1
6.80
7.00
7.20
X body Size
E
8.80
9.00
9.20
Y Span
E1
6.80
7.00
7.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00 REF.
~
Lead Length
e
0.40 Basic
Lead Pitch
0o
~7o
Lead Foot Angle
W
0.13
0.18
0.23
Lead Width
ccc
~
~
0.08
Coplanarity




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