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RF3300-3PCBA Datasheet(PDF) 4 Page - RF Micro Devices

Part # RF3300-3PCBA
Description  3V 1900MHz LINEAR AMPLIFIER MODULE
Download  6 Pages
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Manufacturer  RFMD [RF Micro Devices]
Direct Link  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF3300-3PCBA Datasheet(HTML) 4 Page - RF Micro Devices

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2-550
RF3300-3
Rev A5 030612
Pin
Function
Description
Interface Schematic
1VCC3
Bias circuit and HDET power supply. A low frequency decoupling
capacitor (2.2
µF) is required. Type: P
2GND
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
3GND
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
4RF IN
RF input internally matched to 50
Ω. This input is internally AC-coupled
at the IC; however a shunt inductor used in the input matching network
will provide a DC path to ground for components connected to the RF
IN pin. A DC blocking capacitor may be required at this pin. Type: A, I
5VCC1
First stage power supply. A low frequency decoupling capacitor (2.2
µF)
is required. Type: P
6GND
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
7GND
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
8RF OUT
RF output internally matched to 50
Ω. This input is internally AC-cou-
pled. Type: A, O
9VCC2
Output stage power supply. A low frequency decoupling capacitor
(2.2
µF) is required. Type: P
10
PDET_OUT Power detector output. Type: A, O
11
VMODE
Gain step control. When this pin is High, the module is in low power
mode, and the amplifier’s current is reduced. When this pin is Low, the
module is in high power mode. Voltage should not be applied to this pin
before VCC3 is applied. Type: D, I
12
PA_ON
Device enable control. When this pin is High, the device is on. When
this pin is Low, the device is off. Voltage should not be applied to this
pin before VCC3 is applied. Type: D, I
13
GND_SLUG Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane. Type: P
Note: Where Type code is:
I=Input; O=Output; A=Analog; D=Digital; P=Power
RF IN
From
Bias
Stage
VCC1


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