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74F163A Datasheet(PDF) 7 Page - NXP Semiconductors

Part No. 74F163A
Description  4-bit binary counter
Download  14 Pages
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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74F163A Datasheet(HTML) 7 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74F161A, 74F163A
4-bit binary counters
1996 Jan 29
7
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
MIN
NOM
MAX
UNIT
VCC
Supply voltage
4.5
5.0
5.5
V
VIH
High-level input voltage
2.0
V
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–1
mA
IOL
Low-level output current
20
mA
T
Operating free air temperature range
Commercial range
0
+70
°C
Tamb
Operating free-air temperature range
Industrial range
–40
+85
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS1
MIN
TYP2
MAX
UNIT
VO
High level output voltage
VCC = MIN, VIL = MAX,
IO = MAX
±10%V
CC
2.5
V
VOH
High-level output voltage
CC
,
IL
,
VIH = MIN
IOH = MAX
±5%V
CC
2.7
3.4
V
VO
Low level output voltage
VCC = MIN, VIL = MAX,
IO = MAX
±10%V
CC
0.30
0.50
V
VOL
Low-level output voltage
CC
,
IL
,
VIH = MIN
IOL = MAX
±5%V
CC
0.30
0.50
V
VIK
Input clamp voltage
VCC = MIN, II = IIK
–0.73
–1.2
V
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
100
µA
IIH
High-level input current
VCC = MAX, VI = 2.7V
20
µA
I
Low level input current
CET, PE
VCC = MAX V =0 5V
–1.2
mA
IIL
Low-level input current
others
VCC = MAX, VI = 0.5V
–0.6
mA
IOS
Short-circuit output current3
VCC = MAX
-60
–150
mA
ICC
Supply current (total)
ICCH
VCC = MAX
42
55
mA
ICC
Supply current (total)
ICCL
VCC = MAX
49
65
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.


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