PACKAGING INFORMATION

Rev. A

06/11/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

11 10

9

8

7

6

5

4

3

2

1

A1 CORNER

BOTTOM VIEW

D D1

e

e

E1

E

1

2

3

4

5

6

7

8

9

10

11

A1 CORNER

TOP VIEW

A2

A

A1

φ b (165X)

Ball Grid Array

Package Code: B (165-pin)

Notes:

1. Controlling dimensions are in millimeters.

BGA - 13mm x 15mm

MILLIMETERS

INCHES

Sym.

Min.

Nom.

Max.

Min.

Nom.

Max.

N0.

Leads

165

165

A

—

—

1.20

—

—

0.047

A1

0.25

0.33

0.40

0.010

0.013

0.016

A2

—

0.79

—

—

0.031

—

D

14.90

15.00

15.10

0.587

0.591

0.594

D1

13.90

14.00

14.10

0.547

0.551

0.555

E

12.90

13.00

13.10

0.508

0.512

0.516

E1

9.90

10.00

10.10

0.390

0.394

0.398

e—

1.00

—

—

0.039

—

b

0.40

0.45

0.50

0.016

0.018

0.020