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ISL9206EVAL1 Datasheet(PDF) 2 Page - Intersil Corporation |
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ISL9206EVAL1 Datasheet(HTML) 2 Page - Intersil Corporation |
2 / 16 page 2 FN9260.0 March 9, 2006 Absolute Maximum Ratings (Reference to GND) Thermal Information Supply Voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VDD+0.5V ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .4000V Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .400V CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1000V Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-20°C to 85°C Thermal Resistance (Typical, Note 1) θJA (°C/W) SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -40°C to 125°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -20°C to 85°C; VDD = 2.6V to 4.8V. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Supply Voltage VDD During normal operation 2.6 - 4.8 V During OTP ROM programming 2.8 - 4.8 V Run Mode Supply Current (exclude I/O current) IDD VDD = 4.2V - 110 140 µA VDD = 4.8V - 120 160 µA Sleep Mode Supply Current: IDDS VDD = 4.2V, XSD pin floating - 0.15 0.5 µA OTP Programming Mode Supply Current IDDP For ~ 1.8ms duration per write operation - 250 500 µA Internal Regulated Supply Voltage VRG Observable only in test mode 2.3 2.5 2.7 V Internal OTP ROM Programming Voltage VPP Observable only in test mode 11 12 13 V POR Release Threshold VPOR+ 1.9 2.2 2.4 V POR Assertion Threshold VPOR- 1.5 1.8 2.1 V XSD PIN CHARACTERISTICS XSD Input Low Voltage VIL -0.4 - 0.5 V XSD Input High Voltage VIH 1.5 - VDD+ 0.4V V XSD Input Hysteresis VHYS - 400 - mV XSD Internal Pull-Down Current IPD VDD = 2.6V - 0.8 - µA VDD = 4.2V - 1.2 2.0 µA VDD = 4.8V - 1.8 2.5 µA XSD Output Low Voltage VOL IOL = 1mA - - 0.4 V XSD Input Transition Time tX 10% to 90% transition time - - 2 µs XSD Output Fall Time tF 90% to 10%, CLOAD = 12pF - - 50 ns XSD Pin Capacitance CPIN -6 - pF XSD BUS TIMING CHARACTERISTICS (Refer to XSD Bus Symbol Timing Definitions Tables) Programming Bit Rate x = 0.5 to 4 2.89 - 23.12 kHz XSD Input Deglitch Time TWDG Pulse width narrower than the deglitch time will not cause the device to wake up 7- 20 µs Device Wake-Up Time TWKE From falling-edge of break command issued by host to falling-edge of break command returned by device 35 60 100 µs ISL9206 |
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