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HSDL-3200 Datasheet(PDF) 10 Page - Agilent(Hewlett-Packard)

Part # HSDL-3200
Description  IrDA Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-3200 Datasheet(HTML) 10 Page - Agilent(Hewlett-Packard)

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10
Recommended Metal Solder Stencil
Aperture
It is recommended that only
0.127 mm (0.005 inches) or 0.11
mm (0.004 inches) thick stencil
be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal
stencil thickness should be used:
w, the width of aperture is fixed
at 0.55 mm (0.022 inches).
Aperture opening for shield pad
is as per land pattern.
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keep-out is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
“h” is the minimum solder resist
strip width required to avoid
solder bridging adjacent pads.
It is recommended that two
fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Recommended Solder Paste/Cream
Volume for Castellation Joints
Based on calculation and
experiment, the printed solder
paste volume required per
castellation pad is 0.22 cubic
mm (based on either no-clean or
aqueous solder cream types with
typically 60% to 65% solid
content by volume). Using the
recommended stencil will result
in this volume of solder paste.
t, nominal stencil thickness
l, length of aperture
mm
inches
mm
inches
0.127
0.005
1.75
± 0.05
0.102
± 0.002
0.11
0.004
2.4
± 0.05
0.118
± 0.002
h
Y
X
m
k
j
DIMENSION
mm
INCHES
h
k
j
m
MIN. 0.2
8.2
2.6
3.0
MIN. 0.008
0.323
0.102
0.118
APERTURES AS PER
LAND DIMENSIONS
l
w
t


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