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HSDL-3200 Datasheet(PDF) 9 Page - Agilent(Hewlett-Packard)

Part # HSDL-3200
Description  IrDA Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-3200 Datasheet(HTML) 9 Page - Agilent(Hewlett-Packard)

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9
Moisture Proof Packaging
The HSDL-3200 is shipped in
moisture proof packaging. Once
opened, moisture absorption
begins.
Solder Pad, Mask and Metal Stencil
HSDL-3200#021 Recommended Land Pattern (Front Option)
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCB
STENCIL
APERTURE
SOLDER
MASK
SHIELD SOLDER PAD
a
b
Y
f
d
e
g
Rx LENS
Tx LENS
theta
FIDUCIAL
X
c
8x PAD
FIDUCIAL
DIMENSION
mm
INCHES
a
b
c (PITCH)
d
e
f
g
1.75
0.60
0.95
1.25
2.70
2.20
2.28
0.069
0.024
0.037
0.049
0.106
0.087
0.089
HSDL-3200-028 Recommended Land Pattern (Top Options)
0.60
0.9
;;
;;
2.20
3.625
MOUNTING CENTER
0.575
1.60
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
PITCH 7 x 0.95
;;;
;;
;;
;;
1.275
1.45
Baking should only be done
once.
In Reels
60
°C, t ≥ 48 hours
100
°C, t ≥ 4 hours
In Bulk
125
°C, T ≥ 2 hours
150
°C, T ≥ 1 hour
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
2 days if stored at the recom-
mended storage conditions. If
times longer than 2 days are
needed, the parts must be stored
in a dry box.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Recommended Storage Conditions
Storage Temperature
10
°C to 30°C
Relative Humidity
Below 60%


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