NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground terminals must be connected together with wide ground pattern to decrease impedance

difference.

(4) Do not supply DC voltage to INPUT pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

g

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d

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S

d

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M

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d

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S

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b

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S

n

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d

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C

s

n

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C

Infrared Reflow

Peak temperature (package surface temperature)

: 260 C or below

s

s

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0

1

:

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p

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k

a

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T

Time at temperature of 220 C or higher

: 60 seconds or less

Preheating time at 120 to 180

0

2

1

:

C

30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

IR260

Wave Soldering

Peak temperature (molten solder temperature)

: 260 C or below

s

s

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l

r

o

s

d

n

o

c

e

s

0

1

:

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p

m

e

t

k

a

e

p

t

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m

i

T

Preheating temperature (package surface temperature) : 120 C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

WS260

Partial Heating

Peak temperature (terminal temperature)

: 350 C or below

Soldering time (per side of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

HS350

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PU10613EJ01V0DS

10

PC8231TK