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CY7C1361A-100AJC Datasheet(PDF) 7 Page - Cypress Semiconductor

Part # CY7C1361A-100AJC
Description  256K x 36/512K x 18 Synchronous Flow-Thru Burst SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1361A-100AJC Datasheet(HTML) 7 Page - Cypress Semiconductor

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CY7C1361A
CY7C1363A
Document #: 38-05259 Rev. *A
Page 7 of 26
2B
97
CE2
Input-
Synchronous
Chip Enable: This active HIGH input is used to enable the
device.
(not available for
PBGA)
92
(for A Version only)
CE2
Input-
Synchronous
Chip Enable: This active LOW input is used to enable the
device. Not available for BG and AJ package versions.
4F
86
OE
Input
Output Enable: This active LOW asynchronous input
enables the data output drivers.
4G
83
ADV
Input-
Synchronous
Address Advance: This active LOW input is used to
control the internal burst counter. A HIGH on this pin
generates wait cycle (no address advance).
4A
84
ADSP
Input-
Synchronous
Address Status Processor: This active LOW input, along
with CE being LOW, causes a new external address to be
registered and a Read cycle is initiated using the new
address.
4B
85
ADSC
Input-
Synchronous
Address Status Controller: This active LOW input
causes device to be deselected or selected along with new
external address to be registered. A Read or Write cycle
is initiated depending upon Write control inputs.
3R
31
MODE
Input-
Static
Mode: This input selects the burst sequence. A LOW on
this pin selects Linear Burst. An NC or HIGH on this pin
selects Interleaved Burst.
7T
64
ZZ
Input-
Asynchronous
Sleep: This active HIGH input puts the device in low power
consumption standby mode. For normal operation, this
input has to be either LOW or NC (No Connect).
(a) 6D, 7E, 6F, 7G, 6H,
7K, 6L, 6N, 7P
(b) 1D, 2E, 2G, 1H,
2K, 1L, 2M, 1N, 2P
(a) 58, 59, 62, 63,
68, 69, 72, 73, 74
(b) 8, 9, 12, 13, 18,
19, 22, 23, 24
DQa
DQb
Input/
Output
Data Inputs/Outputs: Low Byte is DQa. High Byte is DQb.
Input data must meet set-up and hold times around the
rising edge of CLK.
2U
3U
4U
38
39
43
for BG and AJ
version
TMS
TDI
TCK
Input
IEEE 1149.1 Test Inputs: LVTTL-level inputs. Not
available for A package version.
5U
42
for BG and AJ
version
TDO
Output
IEEE 1149.1 Test Output: LVTTL-level output. Not
available for A package version.
4C, 2J, 4J, 6J, 4R
15, 41,65, 91
V
CC
Supply
Core Power Supply: +3.3V –5% and +10%
3D, 5D, 3E, 5E, 3F,
5F, 5G, 3H, 5H, 3K,
5K, 3L, 3M, 5M, 3N,
5N, 3P, 5P
5, 10, 17, 21, 26,
40, 55, 60, 67, 71,
76, 90
V
SS
Ground
Ground: GND.
1A, 7A, 1F, 7F, 1J, 7J,
1M, 7M, 1U, 7U
4, 11, 20, 27, 54,
61, 70, 77
V
CCQ
I/O Power
Supply
Power Supply for the I/O circuitry
1B, 7B, 1C, 7C, 2D,
4D, 7D, 1E, 6E, 2F,
1G, 6G, 2H, 7H, 3J,
5J, 1K, 6K, 2L, 4L, 7L,
6M, 2N, 7N, 1P, 6P,
1R, 5R, 7R, 1T, 4T, 6U
1–3, 6, 7, 14, 16,
25, 28–30, 51–53,
56, 57, 66, 75, 78,
79, 80, 95, 96
38, 39, 42 for A
Version
NC
No Connect: These signals are not internally connected.
User can leave it floating or connect it to V
CC or VSS.
512K × 18 Pin Descriptions (continued)
X18 PBGA Pins
X18 QFP Pins
Pin
Name
Type
Pin Description


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