11

HSDL-44xx Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Unit

Ref.

500

mA

Fig. 7, 8

Pulse Width = 100

µs)

DC Forward Current

100

mA

Fig. 6

Power Dissipation

100

mW

5V

Transient Forward Current (10

µs Pulse)

1.0

A

[1]

Operating Temperature

-40

85

°C

Storage Temperature

-55

100

°C

Junction Temperature

110

°C

Lead Solder Temperature

260/5 s

°C

[1.6 mm (0.063 in.) from body]

Reflow Soldering Temperatures

Convection IR

235/90 s

°C

Fig. 20

Vapor Phase

215/180 s

°C

Note:

1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and

the wire bonds.

Parameter

Symbol

Min.

Typ.

Max.

Unit

Condition

Ref.

Forward Voltage

1.30

1.50

1.70

V

Fig. 2

2.15

Forward Voltage

∆V

-2.1

mV/

°CI

Fig. 3

Temperature Coefficient

-2.1

Series Resistance

2

Ω

Diode Capacitance

50

pF

0 V, 1 MHz

Reverse Voltage

520

V

Thermal Resistance,

R

θ

jp

170

°C/W

Junction to Pin