5

5 - 489

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Vdd (Vdc)

Idd (mA)

+6.5

1330

+7.0

1300

+7.5

1285

Typical Supply Current vs. Vdd

Note: Amplifier will operate over full voltage ranges shown

above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V.

Power Dissipation*

5

5.5

6

6.5

7

7.5

8

8.5

9

9.5

10

10.5

-10

-8

-6

-4

-2

0

2

4

6

8

10

12

14

16

INPUT POWER (dBm)

11 GHz

Max Pdiss @ +85C

Absolute Maximum Ratings

Drain Bias Voltage (Vdd1, 2, 3, 4, 5)

+8 Vdc

Gate Bias Voltage (Vgg)

-2.0 to 0 Vdc

RF Input Power (RFin)(Vdd = +7.0 Vdc)

+20 dBm

Channel Temperature

150 °C

Continuous Pdiss (T= 85 °C)

(derate 154 mW/°C above 85 °C)

10 W

Thermal Resistance

(channel to ground paddle)

6.5 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Outline Drawing

* Refer to “Thermal Management for Surface Mount

Components” application note herein.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC487LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H487

XXXX

HMC487LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H487

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Package Information

SURFACE MOUNT PHEMT 2 WATT POWER

AMPLIFIER, 9 - 12 GHz

v01.0705

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS