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HUN2111 Datasheet(PDF) 5 Page - Hi-Sincerity Mocroelectronics |
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HUN2111 Datasheet(HTML) 5 Page - Hi-Sincerity Mocroelectronics |
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5 / 5 page 
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HN200301 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 5/5 HUN21XX Series HSMC Product Specification Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10 oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (T L to TP)<3 oC/sec <3 oC/sec Preheat - Temperature Min (Ts min) - Temperature Max (Ts max) - Time (min to max) (ts) 100 oC 150 oC 60~120 sec 150 oC 200 oC 60~180 sec Tsmax to T L - Ramp-up Rate <3 oC/sec <3 oC/sec Time maintained above: - Temperature (T L) - Time (t L) 183 oC 60~150 sec 217 oC 60~150 sec Peak Temperature (T P) 240 oC +0/-5oC 260 oC +0/-5oC Time within 5 oC of actual Peak Temperature (t P) 10~30 sec 20~40 sec Ramp-down Rate <6 oC/sec <6 oC/sec Time 25 oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245 oC ±5oC 5sec ±1sec Pb-Free devices. 260 oC +0/-5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP 25 t 25oC to Peak Time |
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