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SCAN15MB200TSQX Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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SCAN15MB200TSQX Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 12 page Pin Descriptions (Continued) Pin Name LLP Pin Number I/O, Type Description V DD 6, 12, 37, 43, 48 I, Power V DD = 3.3V ±0.3V. GND (Note 2) I, Power Ground reference for LVDS and CMOS circuitry. For the LLP package, the DAP is used as the primary GND connection to the device. The DAP is the exposed metal contact at the bottom of the LLP-48 package. It should be connected to the ground plane with at least 4 vias for optimal AC and thermal performance. Note 1: For interfacing LVDS outputs to CML or LVPECL compatible inputs, refer to the applications section of this datasheet (planned). Note 2: Note that the DAP on the backside of the LLP package is the primary GND connection for the device when using the LLP package. Note 3: The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the SCAN15MB200 device have been optimized for point-to-point backplane and cable applications. www.national.com 3 |
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