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LP5951MF-1.5 Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LP5951MF-1.5
Description  Micropower, 150mA Low-Dropout CMOS Voltage Regulator
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LP5951MF-1.5 Datasheet(HTML) 4 Page - National Semiconductor (TI)

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Electrical Characteristics(Notes 2, 7) (Continued)
Enable Control Characteristics
Symbol
Parameter
Conditions
Typical
Limit
Units
Min
Max
I
EN
Maximum Input Current
at V
EN Input
0V
≤ V
EN
≤ V
IN,VIN = 5.5V
-1
1
µA
V
IL
Low Input Threshold
(shutdown)
V
IN = 1.8..5.5V
0.4
V
V
IH
High Input Threshold
(enable)
V
IN = 1.8..5.5V
0.9
V
Transient Characteristics
Symbol
Parameter
Conditions
Typical
Limit
Units
Min
Max
∆V
OUT
Dynamic Line Transient V
IN =VOUT(NOM) +1Vto
V
OUT(NOM) + 1V + 0.6V in 30µs, no
load
±2mV
∆V
OUT
Dynamic Load
Transient
I
OUT = 0mA to 150mA in 10µs
I
OUT = 150mA to 0mA in 10µs
I
OUT = 1mA to 150mA in 1µs
I
OUT = 150mA to 1mA in 1µs
-30
20
-50
40
mV
mV
mV
mV
∆V
OUT
Overshoot on Startup
Nominal conditions
10
mV
T
ON
Turn on time
I
OUT = 1mA
30
µs
Output Capacitor, Recommended Specification
Symbol
Parameter
Conditions
Value
Limit(Note 8)
Units
Min
Max
C
OUT
Output Capacitance
Capacitance (Note 9)
I
OUT = 150mA, VIN = 5.0V
V
OUT < 2.8V
V
OUT
≥ 2.8V
1.0
1.5
0.7
1.1
47
47
µF
µF
ESR
0.003
0.300
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160˚C (typ.) and disengages at TJ =
140˚C (typ.).
Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. (MIL-STD-883 3015.7)
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX =TJ-MAX-OP –(θJA x PD-MAX).
Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special attention must be paid to thermal dissipation issues in board design.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8: Min and Max limits are guaranteed by design
Note 9: The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered when selecting
a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R,
Y5V, and Z5U can also be used. The shown minimum limit represents real minimum capacitance, including all tolerances and must be maintained over temperature
and dc bias voltage (See capacitor section in Applications Hints)
Note 10: Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output voltage. This
specification does not apply for input voltages below 1.8V.
www.national.com
4


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