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LP5951MF-1.5 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LP5951MF-1.5 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 10 page Electrical Characteristics(Notes 2, 7) (Continued) Enable Control Characteristics Symbol Parameter Conditions Typical Limit Units Min Max I EN Maximum Input Current at V EN Input 0V ≤ V EN ≤ V IN,VIN = 5.5V -1 1 µA V IL Low Input Threshold (shutdown) V IN = 1.8..5.5V 0.4 V V IH High Input Threshold (enable) V IN = 1.8..5.5V 0.9 V Transient Characteristics Symbol Parameter Conditions Typical Limit Units Min Max ∆V OUT Dynamic Line Transient V IN =VOUT(NOM) +1Vto V OUT(NOM) + 1V + 0.6V in 30µs, no load ±2mV ∆V OUT Dynamic Load Transient I OUT = 0mA to 150mA in 10µs I OUT = 150mA to 0mA in 10µs I OUT = 1mA to 150mA in 1µs I OUT = 150mA to 1mA in 1µs -30 20 -50 40 mV mV mV mV ∆V OUT Overshoot on Startup Nominal conditions 10 mV T ON Turn on time I OUT = 1mA 30 µs Output Capacitor, Recommended Specification Symbol Parameter Conditions Value Limit(Note 8) Units Min Max C OUT Output Capacitance Capacitance (Note 9) I OUT = 150mA, VIN = 5.0V V OUT < 2.8V V OUT ≥ 2.8V 1.0 1.5 0.7 1.1 47 47 µF µF ESR 0.003 0.300 Ω Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160˚C (typ.) and disengages at TJ = 140˚C (typ.). Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. (MIL-STD-883 3015.7) Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP –(θJA x PD-MAX). Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special attention must be paid to thermal dissipation issues in board design. Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 8: Min and Max limits are guaranteed by design Note 9: The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. The shown minimum limit represents real minimum capacitance, including all tolerances and must be maintained over temperature and dc bias voltage (See capacitor section in Applications Hints) Note 10: Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output voltage. This specification does not apply for input voltages below 1.8V. www.national.com 4 |
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