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CPZ19 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CPZ19 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
1 / 2 page ![]() Central Semiconductor Corp. TM PROCESS CPZ19 Zener Diode 0.5 Watt Zener Diode Chip PRINCIPAL DEVICE TYPES CMPZ5235B THRU CMPZ5261B Process EPITAXIAL PLANAR Die Size 18 X 18 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 11 X 11 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 14,000Å PROCESS DETAILS 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com GEOMETRY BACKSIDE CATHODE R2 (1-August 2002) GROSS DIE PER 4 INCH WAFER 36,600 |