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CPD06 Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part No. CPD06
Description  General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip
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Maker  CENTRAL [Central Semiconductor Corp]
Homepage  http://www.centralsemi.com
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CPD06 Datasheet(HTML) 1 Page - Central Semiconductor Corp

   
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145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
PRINCIPAL DEVICE TYPES
1N5400 thru 1N5408
1N5550 thru 1N5554
1N5624 thru 1N5627
CMR3-02 Series
GEOMETRY
PROCESS DETAILS
BACKSIDE CATHODE
R2 (16- September 2003)
Process
GLASS PASSIVATED MESA
Die Size
87 x 87 MILS
Die Thickness
10.4 MILS
Anode Bonding Pad Area
69.5 x 69.5 MILS
Top Side Metalization
Au - 5,000Å
Back Side Metalization
Au - 2,000Å
GROSS DIE PER 4 INCH WAFER
1,490
Central
Semiconductor Corp.
TM
PROCESS
CPD06
General Purpose Rectifier
3 Amp Glass Passivated Rectifier Chip


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