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XRN740-1005FBL Datasheet(PDF) 1 Page - California Micro Devices Corp |
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XRN740-1005FBL Datasheet(HTML) 1 Page - California Micro Devices Corp |
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1 / 1 page © 2000 California Micro Devices Corp. All rights reserved. 8/9/2000 1 XRN740-XXXX CALIFORNIA MICRO DEVICES 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Stable Extended Capability Chip Series California Micro Devices Hx (Stable Extended Capability Chip) Series offer exceptional stability and low noise. Available in the standard center tapped configuration, C1360800 Bonding Area Laser Code Area Formats Die Size: 45±3 mils square Bonding Pads: 4x4 mils typical 1 M Ω Ω Ω Ω Ω to 20 MΩ Ω Ω Ω Ω they have low electro migration qualities and extremely low TCR. R1 R2 s n o i t a c i f i c e p S l a c i n a h c e M e t a r t s b u Sk c i h t s li m 2 ± 0 1 n o c il i S r e y a L n o i t a l o s I0 i S 2 n i m , k c i h t Å 0 0 0 , 0 1 r o t s i s e Re m o r h C n o c il i S y r a t e i r p o r P g n i k c a B) l a n o i t p o d l o g ( d e p p a L s d a P d n o Bn i m , k c i h t Å 0 0 0 , 0 1 m u n i m u l A g n i g a k c a P . d r a d n a t s s i m u m i x a m s p i h c 0 0 4 f o s y a r t e r a u q s h c n i o w T s e t o N r e s a l c i r e m u n a h p l a r o f e l b a li a v a e r a s e x o b e d o C . 1 . p i h c e h t n o g n i k r a m . r e h t o n a o t e u l a v e n o m o r f y r a v y a m n r e t t a p r o t s i s e R . 2 n o i t a n g i s e D r e b m u N t r a P 0 4 7 N R X5 0 0 1F A G W P s e i r e Se u l a V e c n a t s i s e Re c n a r e l o TR C Ts d a P d n o Bg n i k c a Be c n a r e l o T o i t a R e r a s t i g i d 3 t s r i F t n a c i f i n g i s . e u l a v t i g i d t s a L s t n e s e r p e r f o r e b m u n . s o r e z s e t a c i d n i R . t n i o p l a m i c e d % 5 . 0 ± = Dm p p 0 0 1 ± = r e t t e L o Nd l o G = Gd l o G = W% 1 ± = d t S % 1 ± = Fm p p 0 5 ± = A = r e t t e L o N m u n i m u l A d e p p a L = L% 5 . 0 ± = P % 2 ± = Gm p p 5 2 ± = B = r e t t e L o N r e h t i E % 5 ± = J % 0 1 ± = K s n o i t a c i f i c e p S l a c i r t c e l E r e t e m a r a Ps n o i t i d n o C R C TC ° 5 2 1 o t C ° 5 5 – m p p 0 0 1 ±x a M R C T TC ° 5 2 1 o t C ° 5 5 – C ° / m p p 5 ±x a M e g a t l o V g n i t a r e p OC ° 5 2 1 o t C ° 5 5 – c d V 0 0 1x a M g n i t a R r e w o P ) C ° 0 5 1 @ o r e z o t y l r a e n i l e t a r e D ( C ° 0 7 @w m 5 2 1x a M n o i t a r e Ds r a e y 2 r o f C ° 0 3% 1 . 0 ± ∆ x a M k c o h S l a m r e h TF 2 0 2 - D T S - L I M 7 0 1 d o h t e M% 2 . 0 ± ∆Rx a M e r u s o p x E e r u t a r e p m e T h g i Ht n e i b m A C ° 0 5 1 @ s r H 0 0 1% 5 1 . 0 ±x a M e c n a t s i s e R e r u t s i o MF 2 0 2 - D T S - L I M 6 0 1 d o h t e M% 2 . 0 ± ∆Rx a M e f i L ) r h 0 0 0 1 / C ° 5 2 1 ( F 2 0 2 - D T S - L I M 8 0 1 d o h t e M% 2 . 0 ± ∆Rx a M e s i o N K 0 5 2 o t p u F 2 0 2 - D T S - L I M 8 0 3 d o h t e M Ω ≥ K 0 5 2 Ω B d 5 3 – B d 0 2 – x a M e c n a t s i s e R n o i t a l u s n IC ° 5 2 @0 1 X 1 2 1 Ω n i M s e u l a V M 1 Ω M 0 2 o t Ω n e e w t e b e c n a r e l o t o i t a r d r a d n a t S . d r a d n a t s . e l b a li a v a e c n a r e l o t o i t a r r e t h g i T . % 1 ± = s r o t s i s e r |
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