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AS1107WL-T Datasheet(PDF) 2 Page - ams AG |
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AS1107WL-T Datasheet(HTML) 2 Page - ams AG |
2 / 20 page www.austriamicrosystems.com Revision 2.2 2 - 20 AS1106, AS1107 austriamicrosystems Data Sheet 4 Absolute Maximum Ratings Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 1. Absolute Maximum Ratings Parameter Min Max Units Notes Voltage (with respect to GND) VDD -0.3 7 V DIN, CLK, LOAD/CSN -0.3 7 V All other pins -0.3 7 or VDD + 0.3 V Current DIG 0:DIG 7 Sink Current 500 mA SEG A:SEG G, SEG DP 100 mA Continuous Power Dissipation (TAMB = +85ºC) Narrow plastic DIP 1066 mW Derate 13.3mW/ºC above +70ºC Wide SOIC 941 mW Derate 11.8mW/ºC above +70ºC Operating Temperature Ranges (TMIN toTMAX) AS1106PL, AS1106WL 0 +70 ºC AS1106PE, AS1106WE -40 +85 ºC AS1107PL, AS1107WL 0 +70 ºC Storage Temperature Range -65 +150 ºC Package Body Temperature (Wide SOIC) 1 1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices”. +260 ºC Soldering Temperature (Narrow DIP) 2 2. Specified according JESD22-B106 “Resistance to Soldering Temperature for Through-Hole Mounted Devices”. +260 ºC Humidity 5 85 % Non-condensing Electrostatic Discharge 3 3. Norm: MIL 883 E method 3015. Digital outputs 1000 V All other pins 1000 V Latch-Up Immunity 4 4. Norm: JEDEC 17. ±200 mA All pins except AS1106 pin 14: ±180 mA |
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