No.8178-6/8

LA4632

[Thermal Protection Circuit]

• The LA4632 includes an on-chip thermal protection circuit to prevent degradation or destruction of the IC due to

abnormal heating. If this IC's junction temperature (Tj) rises above 160°C due to and insufficient heat sink or other

reason, the thermal protection circuit will operate and gradually reduce the output signal level. This protection

function clears automatically as the temperature falls.

Notes on Printed Circuit Boards

each other. (This is to prevent increased distortion, oscillation, and other problems.)

Notes on Heat Sink Attachment

Foreign matter such as metal chips must not be trapped between the IC's heat sink and the externally attached heat sink.

If a grease is used between the IC and the external heat sink, be sure to apply the grease evenly to the whole contact

surface.

Other Notes

The LA4632 is a BTL power amplifier IC. When connecting test equipment, the test equipment used for the input

system and the test equipment used for the output system must not share the same ground.

2

0

10

20

30

40

100

60

70

80

90

50

48

16

610

14

12

18

24

20

22

ICCO -- VCC

ILA06995

THD -- PO

ILA06997

6

4

0

4

8

12

16

22

20

2

6

10

14

18

816

20

12

14

18

10

24

22

PO -- VCC

ILA06996

VCC=13V

RL=4Ω

0.1

1.0

23

5

7

3

10

22

35

7

7

5

3

10

2

3

2

7

5

7

5

1.0

3

0.1

RL=Open

Rg=0

f=1kHz

THD=10%

f=10kHz

f=100Hz

f=1kHz

THD -- PO

ILA06998

VCC=13V

RL=6Ω

0.1

1.0

23

5

7

2

1.0

35

7

2

7

5

3

10

2

3

2

7

5

7

5

1.0

3

0.1

f=10kHz

f=100Hz

f=1kHz

Supply voltage, VCC - V

Supply voltage, VCC - V

Output power, PO - W

Output power, PO - W