17.0-35.0 GHz GaAs MMIC

Low Noise Amplifier

Page 5 of 8

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 28LN2BA0047)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.416 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (V1)

Bond Pad #3 (V2)

Bond Pad #4 (V3)

Bond Pad #5 (V4)

Bond Pad #6 (RF Out)

Bond Pad #7 (V8)

Bond Pad #8 (V7)

Bond Pad #9 (V6)

Bond Pad #10 (V5)

March 2005 - Rev 01-Mar-05

L1001

1

2

3

4

5

6

7

8

9

10

RF Out

V1*

RF In

V5*

1

2

3

4

5

1.950

(0.077)

1.176

(0.046)

0.658

(0.026)

1.288

(0.051)

0.0

0.0

1.374

(0.054)

6

7

8

0.973

(0.038)

0.775

(0.031)

1.176

(0.046)

0.973

(0.038)

0.775

(0.031)

9

10

1.374

(0.054)

2.000

(0.079)

*V1 or V5 may be used, but both are not required.

RF In

RF Out

V5