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XL1000 Datasheet(PDF) 5 Page - Mimix Broadband

Part No. XL1000
Description  20.0-40.0 GHz GaAs MMIC Low Noise Amplifier
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Maker  MIMIX [Mimix Broadband]
Homepage  http://www.mimixbroadband.com
Logo MIMIX - Mimix Broadband

XL1000 Datasheet(HTML) 5 Page - Mimix Broadband

  XL1000 Datasheet HTML 1Page - Mimix Broadband XL1000 Datasheet HTML 2Page - Mimix Broadband XL1000 Datasheet HTML 3Page - Mimix Broadband XL1000 Datasheet HTML 4Page - Mimix Broadband XL1000 Datasheet HTML 5Page - Mimix Broadband XL1000 Datasheet HTML 6Page - Mimix Broadband XL1000 Datasheet HTML 7Page - Mimix Broadband  
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20.0-40.0 GHz GaAs MMIC
Low Noise Amplifier
Page 5 of 7
Mechanical Drawing
Bias Arrangement
Bypass Capacitors - See App Note [2]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
(Note: Engineering designator is 28LN3UA0338)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.239 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #3 (Vd)
Bond Pad #4 (Vd)
L1000
RF Out
RF In
Vd
XL1000
April 2005 - Rev 01-Apr-05
2
1
3
4
1.000
(0.039)
0.678
(0.027)
0.0
0.0
2.000
(0.079)
1.880
(0.074)
0.309
(0.012)
0.678
(0.027)
2
1
3
4
L1000
Vd
RF In
RF Out


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