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HD66421TB0 Datasheet(PDF) 3 Page - Hitachi Semiconductor |
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HD66421TB0 Datasheet(HTML) 3 Page - Hitachi Semiconductor |
3 / 46 page Preliminary Rev. 1.1E '99.02.10 HD66421 Pad Location Coordinate No. PAD NAME X Y No. PAD NAME X Y No. PAD NAME X Y 1 COM1 -4217 1731 31 COM31 -4217 230 61 SEG11 -4217 -1299 2 COM2 -4217 1681 32 COM32 -4217 179 62 SEG12 -4217 -1349 3 COM3 -4217 1631 33 COM33 -4217 129 63 SEG13 -4217 -1399 4 COM4 -4217 1581 34 COM34 -4217 79 64 SEG14 -4217 -1449 5 COM5 -4217 1531 35 COM35 -4217 29 65 SEG15 -4217 -1499 6 COM6 -4217 1481 36 COM36 -4217 -21 66 SEG16 -4217 -1549 7 COM7 -4217 1430 37 COM37 -4217 -71 67 SEG17 -4217 -1599 8 COM8 -4217 1380 38 COM38 -4217 -121 68 SEG18 -4217 -1649 9 COM9 -4217 1330 39 COM39 -4217 -171 69 SEG19 -4217 -1699 10 COM10 -4217 1280 40 COM40 -4217 -221 70 SEG20 -4217 -1749 11 COM11 -4217 1230 41 COM41 -4217 -271 71 SEG21 -4217 -1799 12 COM12 -4217 1180 42 COM42 -4217 -321 72 SEG22 -4217 -1849 13 COM13 -4217 1130 43 COM43 -4217 -371 73 SEG23 -4217 -1899 14 COM14 -4217 1080 44 COM44 -4217 -421 74 SEG24 -4217 -1949 15 COM15 -4217 1030 45 COM45 -4217 -471 75 dummy A -4217 -2082 16 COM16 -4217 980 46 COM46 -4217 -521 76 dummy 1 -4029 -2082 17 COM17 -4217 930 47 COM47 -4217 -571 77 dummy 2 -3907 -2082 18 COM18 -4217 880 48 COM48 -4217 -621 78 dummy 3 -3827 -2082 19 COM19 -4217 830 49 COM49 -4217 -671 79 dummy 4 -3619 -2082 20 COM20 -4217 780 50 COM50 -4217 -721 80 dummy 5 -3497 -2075 21 COM21 -4217 730 51 SEG1 -4217 -798 81 dummy 6 -3419 -2075 22 COM22 -4217 680 52 SEG2 -4217 -848 82 SEG25 -2822 -2082 23 COM23 -4217 630 53 SEG3 -4217 -898 83 SEG26 -2772 -2082 24 COM24 -4217 580 54 SEG4 -4217 -948 84 SEG27 -2722 -2082 25 COM25 -4217 530 55 SEG5 -4217 -998 85 SEG28 -2672 -2082 26 COM26 -4217 480 56 SEG6 -4217 -1049 86 SEG29 -2622 -2082 27 COM27 -4217 430 57 SEG7 -4217 -1099 87 SEG30 -2572 -2082 28 COM28 -4217 380 58 SEG8 -4217 -1149 88 SEG31 -2522 -2082 29 COM29 -4217 330 59 SEG9 -4217 -1199 89 SEG32 -2472 -2082 30 COM30 -4217 280 60 SEG10 -4217 -1249 90 SEG33 -2422 -2082 GND7 COM1 SEG24 dummyA dummy1 GND8 dummy12 dummy8 SEG137 COM100 GND1 GND2 Type code HD66421 Pad Arrangement Chip size : 8.99 x 4.72 mm Coordinate : Pad center Origin : Chip Center Bump size : GND1, GND8, dummy A, dummy B 70 x 70 µm Power, I/O (Pad No. 276 to 321) 50 x 70 µm COM1 - 100, SEG1 - 160, dummy1 -12 35 x 50 µm 3 |
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