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BCCS++ Datasheet(PDF) 2 Page - STATS ChipPAC, Ltd.

Part No. BCCS++
Description  Bump Chip Carrier
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Maker  STATSCHIP [STATS ChipPAC, Ltd.]
Homepage  http://www.statschippac.com
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BCCS++ Datasheet(HTML) 2 Page - STATS ChipPAC, Ltd.

   
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The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.
May 2006
Corporate Office
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices
USA 510-979-8000
JAPAN 81-3-5789-5850
CHINA 86-21-5976-5858
MALAYSIA 603-4257-6222
KOREA 82-31-639-8911
TAIWAN 886-3-593-6565
UK 44-1483-413-700
NETHERLANDS 31-38-333-2023
BCC
Bump Chip Carrier
SPECIFICATIONS
Die Thickness
279
µm nominal, 355µm max.
Gold Wire
25
µm (1.0mils) diameter
Lead Finish
Preplated Ni/Pd/Au bumps
Marking
Laser
Packing Options
Tape & reel / JEDEC tray
RELIABILITY
Moisture Sensitivity Level
JEDEC Level 2a/2/1@260°C
(depending upon package)
Temperature Cycling
-65°C/150°C, 1000 cycles
High Temp Storage
150°C, 1000 hrs
Temp / Humidity Test
85°C/85% RH, 1000 cycles
Pressure Cooker Test
121°C, 100% RH, 2 atm,
168 hrs
CROSS-SECTIONS
PACKAGE CONFIGURATIONS
Package Size
Lead Pitch
Lead Count
(mm)
(mm)
4 x 4
0.80
16
5 x 5
0.50
32
6 x 6
0.50
40
7 x 7
0.50
48 / 84
8 x 8
0.50
56
9 x 9
0.50
11 6
BCC+
BCC++
BCCs++
BCCs+


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