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BCC Datasheet(PDF) 2 Page - STATS ChipPAC, Ltd. |
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BCC Datasheet(HTML) 2 Page - STATS ChipPAC, Ltd. |
2 / 2 page The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. ©Copyright 2006. STATS ChipPAC Ltd. All rights reserved. May 2006 Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 Global Offices USA 510-979-8000 JAPAN 81-3-5789-5850 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023 BCC Bump Chip Carrier SPECIFICATIONS Die Thickness 279 µm nominal, 355µm max. Gold Wire 25 µm (1.0mils) diameter Lead Finish Preplated Ni/Pd/Au bumps Marking Laser Packing Options Tape & reel / JEDEC tray RELIABILITY Moisture Sensitivity Level JEDEC Level 2a/2/1@260°C (depending upon package) Temperature Cycling -65°C/150°C, 1000 cycles High Temp Storage 150°C, 1000 hrs Temp / Humidity Test 85°C/85% RH, 1000 cycles Pressure Cooker Test 121°C, 100% RH, 2 atm, 168 hrs CROSS-SECTIONS PACKAGE CONFIGURATIONS Package Size Lead Pitch Lead Count (mm) (mm) 4 x 4 0.80 16 5 x 5 0.50 32 6 x 6 0.50 40 7 x 7 0.50 48 / 84 8 x 8 0.50 56 9 x 9 0.50 11 6 BCC+ BCC++ BCCs++ BCCs+ |
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