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33975 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

Part No. 33975
Description  Multiple Switch Detection Interface with Suppressed Wake-Up and 32mA Wetting Current
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Maker  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
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33975 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc

 
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33975
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage
-0.3 to 7.0
VDC
CS,
SI, SO, SCLK, INT, AMUX
-0.3 to 7.0
VDC
WAKE
-0.3 to 40
VDC
VPWR Supply Voltage
-0.3 to 50
VDC
Switch Input Voltage Range
MC33975
PC339775A
-14 to 38
-14 to 40
VDC
Frequency of SPI Operation (VDD = 5.0 V)
6.0
MHz
ESD Voltage (1)
Human Body Model (2)
Applies to all non-input terminals
Machine Model
Charge Device Model
Corner Terminals
Interior Terminals
VESD
±4000
±2500
±200
750
500
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
TA
TJ
TC
-40 to 125
-40 to 150
-40 to 125
°C
Storage Temperature
TSTG
-55 to 150
°C
Power Dissipation (3)
PD
1.7
W
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad (4)
RθJA
RθJC
71
1.2
°C/W
Peak Package Reflow Temperature During Solder Mounting (5)
TSOLDER
245
°C
Notes
1.
ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (CZAP = 200
pF, RZAP = 0 Ω), and the Charge Device Model.
2.
All Programmable Switches (SP) and Switch-to-Ground (SG) input terminals when tested individually.
3.
Maximum power dissipation at TJ =150°C junction temperature with no heatsink used.
4.
Thermal resistance between the die and the exposed die pad.
5.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.


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