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CML0402C0G100CT100V Datasheet(PDF) 4 Page - Stackpole Electronics, Inc. |
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CML0402C0G100CT100V Datasheet(HTML) 4 Page - Stackpole Electronics, Inc. |
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4 / 23 page  Rev Date: 5/27/2021 4 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. CML_C0G Series Multilayer Ceramic Chip Capacitor Stackpole Electronics, Inc. Resistive Product Solutions Environmental Characteristics Test Capacitance Measuring Frequency Measuring Voltage Cr < 5 pF 5 pF ≤ Cr < 50 pF 50 pF ≤ Cr ≤ 1000 pF > 1000 pF 1 KHZ ± 10% Step Temp. ( °C ) Time (min.) Low-category temp. C0G: -55ºC 2 Normal temp. (+20) 2 - 3 Up-category temp. C0G: +125ºC 4 Normal temp. (+20ºC) 2 - 3 Resistance to Soldering Heat Insulation Resistance C ≤ 10 nF, Ri ≥ 50000 MΩ Measuring Voltage: Rated Voltage (Max 500V) C > 10 nF, RI*CR ≥ 500 S Duration: 60 ± 5 seconds Test Specification Test Condition C0G: (Class I) Cap ≤ 1000 pF 1.0 ± 0.2 Vrms, 1 MHz ± 10% Cap > 1000 pF 1.0 ± 0.2 Vrms, 1 KHz ± 10% Dissipation Factor (DF) C0G (Class I) DF ≤ 0.56% Capacitance Should be within the specified tolerance. 1 MHZ ± 10% 1 ± 0.2 Vrms 1.5 [(150 / Cr) + 7] x 10 - 4 ≤ 0.15% ≤ 0.15% Solderability At least 95% of the terminal electrode is covered by new solder. Visual appearance: No visible damage. Duration: 2 ± 0.5 seconds Solder Temperature: 245ºC ± 5°C (Lead-free) Duration: 2 ± 0.5 seconds Dielectric Withstanding Voltage No breakdown or damage. Measuring voltage: Class I: 300% rated voltage Duration: 1 ~ 5 seconds Charge/Discharge Current: 50 mA max. Unit: mm C0G (Class I) Test Humidity: ≤ 75% Test Temperature: 25°C ± 5°C Duration: 10 ± 1 seconds DF Same to initial value Clean the capacitor with solvent and examine it with a 10X (min.) microscope. IR Same to initial value Test Current: ≤ 50 mA Recovery Condition: Room temperature. C0G ≤ ± 0.5% or ± 0.5 pF whichever is larger Item Preheating Conditions: 100ºC to 200°C; 10 ± 2 minutes Δ C/C Solder Temperature: 265ºC ± 5°C Appearance: No visible damage. At least 95% of the terminal electrode is covered by new solder. Recovery Time: 24 ± 2 hours Appearance: No visible damage. Δ C/C: ≤ ± 10% Preheating Conditions: 80ºC to 120°C, 10 ~ 30 seconds Solder Temperature: 235ºC ± 5% (Sn/Pb: 63/37) Resistance to Flexure of Substrate (Bending Strength) Test Board: AI2O3 or PCB Warp: 1 mm Speed: 0.5 mm/second The measurement should be made with the board in the bending position. 3 30 ± 3 Termination Adhesion No visible damage Applied Force: 5 N Duration: 10 ± 1 seconds Temperature Cycle Preheating Conditions: up-category Recovery Time: 24 ± 1 hours Initial Measurement Cycling times: 5 times, 1 cycle, 4 steps: C0G: Δ C/C: ≤ ± 1% or ± 1 pF, whichever is larger Recovery time after test: 24 ± 2 hours 1 Temperature: 1 hour 30 ± 3 |
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