© 2005 California Micro Devices Corp. All rights reserved.

11/08/05

490 N. McCarthy Blvd., Milpitas, CA 95035-5112

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Tel: 408.263.3214

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Fax: 408.263.7846

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www.cmd.com

7

CM1441

Application Information

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages

offered by California Micro Devices.

Figure 6. Recommended Non-Solder Mask Defined Pad Illustration

Figure 7. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 8. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

0.240mm

Pad Shape

Round

Pad Definition

Non-Solder Mask defined pads

Solder Mask Opening

0.290mm Round

Solder Stencil Thickness

0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.300mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball

+50

μm

Solder Ball Side Coplanarity

+20

μm

Maximum Dwell Time Above Liquidous (183°C)

60 seconds

Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste

240°C

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste

260°C

Solder Mask Opening

0.290mm DIA.

Non-Solder Mask Defined Pad

0.240mm DIA.

Solder Stencil Opening

0.300mm DIA.

200

250

150

100

50

0

1:00.0

2:00.0

3:00.0

4:00.0

Time (minutes)