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CYStech Electronics Corp.
Spec. No. : C513L3
Issued Date : 2003.04.09
Revised Date :2005.05.03
Page No. : 9/9
LM317L3
CYStek Product Specification
SOT-223 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1142
0.1220
2.90
3.10
G
0.0551
0.0709
1.40
1.80
B
0.2638
0.2874
6.70
7.30
H
0.0098
0.0138
0.25
0.35
C
0.1299
0.1457
3.30
3.70
I
0.0008
0.0039
0.02
0.10
D
0.0236
0.0315
0.60
0.80
a1
*13o
-
*13o
-
E
*0.0906
-
*2.30
-
a2
0 o
10 o
0 o
10 o
F
0.2480
0.2638
6.30
6.70
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
3
2
1
F
B
A
C
D
E
G
H
a1
a2
I
Style: Pin 1.Adj 2.Output 3.Input
Marking:
3-Lead SOT-223 Plastic
Surface Mounted Package
CYStek Package Code: L3
317
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