SN74AUP1G17

LOW POWER SINGLE SCHMITT TRIGGER BUFFER

SCES579C – JUNE 2004 – REVISED NOVEMBER 2005

2

POST OFFICE BOX 655303

description/ordering information (continued)

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition

and better switching-noise immunity at the input.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74AUP1G17YEPR

_ _ _H7_

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

Reel of 3000

SN74AUP1G17YZPR

_ _ _H7_

−40

°C to 85°C

SOT (SOT-23) − DBV

Reel of 3000

SN74AUP1G17DBVR

H17_

−40

°C to 85°C

SOT (SOT-23) − DBV

Reel of 250

SN74AUP1G17DBVT

H17_

SOT (SC-70) − DCK

Reel of 3000

SN74AUP1G17DCKR

H7_

SOT (SC-70) − DCK

Reel of 250

SN74AUP1G17DCKT

H7_

SOT (SOT-553) − DRL

Reel of 4000

SN74AUP1G17DRLR

H7_

www.ti.com/sc/package.

‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

FUNCTION TABLE

INPUT

A

OUTPUT

Y

H

H

L

L

logic diagram (positive logic)

A

Y

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