NTCS0805E3.....T

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Vishay BCcomponents

Revision: 21-Sep-2021

2

Document Number: 29044

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS

SOLDERING CONDITIONS

Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.

PACKAGING

TAPE SPECIFICATIONS

All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.

PAPER TAPE

Notes

T

W

WT

MIN.

MIN.

2.0 ± 0.2

1.25 ± 0.15

0.8 ± 0.15

0.2

0.55

Time (s)

0

50

100

150

200

200

250

100

150

50

0

300

250

260 °C

≈ 245 °C

215 °C

180 °C

130 °C

2 K/s

40 s

10 s

10 s

Reflow Soldering

Lead (Pb)-free Reflow Soldering Profile

260 °C

≈ 245 °C

235 °C

≈ 170 °C

≈ 120 °C

2 K/s

max.

Time (s)

0

50

100

150

200

350

200

250

100

150

50

0

300

40 s max.

≈ 60 s

20 s min.

normal

limit

250

300

6 K/s

max.

3.0

1.3

1.0

Dimensions of the solder lands

F

W

P

0

P

2

D

0

B0

A

0

P

1

E

1

JWB288

T

T

1

DIMENSIONS OF PAPER TAPE in millimeters

PARAMETER

DIMENSION

1.7 ± 0.2

2.35 ± 0.1

W

8.0 ± 0.2

1.75 ± 0.1

F

3.5 ± 0.05

1.55 ± 0.05

4.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

T tape thickness max.

1.1

0.1