ADVANCE INFORMATION

WCMC1616V9X

Document #: 38-14027 Rev. **

Page 4 of 13

Parameter

Description

Test Conditions

WCMC1616V9X-70

Unit

Min.

Max.

Vcc

Supply Voltage

2.7

3.3

V

Output HIGH Voltage

V

Output LOW Voltage

0.4

V

Input HIGH Voltage

V

Input LOW Voltage

F = 0

−0.4

0.4

V

Input Leakage Current

−1

+1

µA

Output Leakage Current

−1

+1

µA

Current

Vcc = 3.3V,

CMOS level

13

17

mA

f = 1 MHz

2

3.5

Automatic CE Power-down

Current

− CMOS Inputs

f = 0 (OE, WE, BHE and BLE)

100

525

µA

Automatic CE Power-down

Current

− CMOS Inputs

80

150

µA

Parameter

Description

Test Conditions

Max.

Unit

Input Capacitance

8

pF

Output Capacitance

8

pF

Parameter

Description

Test Conditions

FBGA

Unit

θ

JA

Thermal Resistance (Junction to

Ambient)

Still Air, soldered on a 3 x 4.5 inch, two-layer

printed circuit board

55

°C/W

θ

JC

Thermal Resistance (Junction to

Case)

17

°C/W

Note:

10. Tested initially and after design or process changes that may affect these parameters.