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MAX14850AEE+ Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX14850AEE+
Description  Six-Channel Digital Isolator
Download  17 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX14850AEE+ Datasheet(HTML) 2 Page - Maxim Integrated Products

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VCCA to GNDA........................................................-0.3V to +6V
VCCB to GNDB........................................................-0.3V to +6V
OUTA1, OUTA2 to GNDA....................... -0.3V to (VCCA + 0.3V)
OUTB1, OUTB2 to GNDB...................... -0.3V to (VCCB + 0.3V)
INA1, INA2, I/OA1, I/OA2 to GNDA ........................-0.3V to +6V
INB1, INB2, I/OB1, I/OB2 to GNDB ........................-0.3V to +6V
Short-Circuit Duration (OUTA_ to GNDA or
VCCA, OUTB_ to GNDB or VCCB) ........................Continuous
Continuous Current (I/OA_, I/OB_) Pin............................±50mA
Continuous Power Dissipation (TA = +70°C)
SOIC (derate 13.3mW/°C above +70°C)...................1067mW
QSOP (derate 9.6mW/°C above +70°C)..................771.5mW
Operating Temperature Range......................... -40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow).......................................+260°C
Package Code
S16+3
Outline Number
21-0041
Land Pattern Number
90-0097
THERMAL RESISTANCE, MULTILAYER BOARD
Junction to Ambient (θJA)
75°C/W
Junction to Case (θJC)
24°C/W
Package Code
E16+1
Outline Number
21-0055
Land Pattern Number
90-0167
THERMAL RESISTANCE, MULTILAYER BOARD
Junction to Ambient (θJA)
103.7°C/W
Junction to Case (θJC)
37°C/W
16 SOIC
16 QSOP
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
MAX14850
Six-Channel Digital Isolator
www.maximintegrated.com
Maxim Integrated │ 2


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