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W536090K Datasheet(PDF) 8 Page - Winbond

Part # W536090K
Description  VOICE/MELODY/LCD CONTROLLER (ViewTalk TM Series)
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W536090K Datasheet(HTML) 8 Page - Winbond

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W536020K/030K/060K/090K/120K
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PAD Description, continued
SYMBOL
I/O
FUNCTION
COM0
−COM3
O
LCD common signal output pads either 1/8 duty or 1/4duty. The LCD
frame rate is controlled by LCDM1 register, and default value LCDM1 =
0111b with 64Hz frame rate.
COM4/PORTO.0
COM7/PORTO.3
O/I
LCD common signal output pads, or shared as general input by register
LCDM3.2 when in 1/4 duty mode. Default function is common function
and PM5.2 = 0 to inhibit LCD waveform abnormal.
DH1, DH2 (6)
O
Connection terminal for voltage double capacitor with 0.1uF. The DH2
connects to capacitor positive node and DH1 negative node if polar
capacitor is used.
VHI
I
Connect to V6 (LCD's VLCD) or VDD which has higher voltage, to make
sure there is no any abnormal leakage current appearance.
V3
O
LCD COM/SEG output driving voltage. Need an external 0.1uF
capacitor when 1/4 bias. (LCDM0.1 = 1)
V5 V6 (6)
O
LCD COM/SEG output driving voltage. Need an external 0.1uF
capacitor to every pad terminal.
V2 (6)
I/O
Voltage regulator output pad. An external capacitor is a must. Output
level can be controlled from 0~Fh by LCDM4 register. If internal pump is
enabled (LCDM3.3 = 0 and default value), LCD operating voltage
(VLCD) will be 3*V2 or 4*V2 depending on 1/3 bias or 1/4 bias. A
limitation should be noted that VLCD must be higher than (VDD -0.5v) to
avoid chip leakage current. While external reference voltage is selected
(LCDM3.3 = 1), V2 pad input voltage can not be over 1.5 Volt to inhibit
chip damage.
VSSP (7)
I
Power ground for PWM or DAC playing output.
VSS (7)
I
Power ground
VDDP (7)
I
Power source for PWM or DAC playing output.
VDD (7)
I
Power Source
Notes:
(4)
RD1~3 are shared as CLK/DATA/ADDR to interface with W55XXX @W536020K/030K.
(5)
@W536120K only
(6)
0.1uF is default value, and capacitor value should be larger than 0.1uF if LCD dot size over 0.5mm * 0.5mm.
(7)
External application circuit should connect together, please refer to APPLICATION CIRCUIT. To sure chip operation
properly, please bond all VDD, VDDP, VSS and VSSP pads and connect VSS and VSSP from chip outside PCB circuit.
(8)
VHI pad is bonded to V6 or VDD.
(9)
When working at NMOS open drain mode, external pull high voltage can't bigger than VDD to avoid leakage current.


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