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EM65101 Datasheet(PDF) 9 Page - ELAN Microelectronics Corp |
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EM65101 Datasheet(HTML) 9 Page - ELAN Microelectronics Corp |
9 / 83 page EM65101 128COM/160SEG 16 Gray Scale Level LCD Driver Product Specification (V0.4) 08.15.2005 • 3 (This specification is subject to change without further notice) 4.2 Pin Dimensions Bump Size Item Pad No. X Y Unit Chip size - 10850 1380 1 ~ 3 ; 144 ~ 146 88 38 4 ~ 51 ; 99 ~ 143 35 78 52 ~ 98 50 61 147 ~ 169 ; 418 ~ 440 96 28 Bump Size 170 ~ 417 28 96 1 ~ 3 ; 144 ~ 146 103 4 ~ 51 ; 99 ~ 143 50 52 ~ 98 65 147 ~ 169 ; 418 ~ 440 43 170 ~ 417 43 Pad Pitch Min pitch 43 Die thickness (excluding bumps) 20 ± 1 mil (500 ± 25 um) Bump Height 17 ± 3 um Minimum Bump Gap 15 um Coordinate Origin Chip center µm 4.3 Recommended COG ITO Traces Resistor Interface ITO Traces Resistances V0~V4 CAP1+, CAP1-, CAP2+, CAP2-,CAP3+,CAP3- CAP4+, CAP5+, VOUT, V2X VDD, VEE, VSS Max=50Ω WRB,RDB,CSB,…, D0~D7 Max=3KΩ RESB Max=5~10KΩ |
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