OPA333AIDBVTG4 datasheet(2/18 Pages) BURR-BROWN

Part #	OPA333AIDBVTG4

Description	1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series

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Manufacturer	BURR-BROWN [Burr-Brown (TI)]

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2 / 18 page

OPA333

OPA2333

SBOS351 − MARCH 2006

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage

+7V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals, Voltage(2)

−0.3V to (V+) + 0.3V

. . . . . . . . .

Signal Input Terminals, Voltage(2)

±10mA

. . . . . . . . . . . . . . . . . . . .

Output Short-Circuit(3)

Continuous

. . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−40

°C to +150°C

. . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−65

°C to +150°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Rating

Human Body Model

4000V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charged Device Model

1000V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.3V beyond the supply

rails should be current limited to 10mA or less.

(3) Short-circuit to ground, one amplifier per package.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

OPA333

SOT23-5

DBV

OAXQ

OPA333

SOT23-5

DBV

OAXQ

OPA333

SC70-5

DCK

BQY

OPA333

SC70-5

DCK

BQY

OPA333

SO-8

D

O333A

OPA333

SO-8

D

O333A

OPA2333

SO-8

D

O2333A

OPA2333

SO-8

D

O2333A

OPA2333

DFN-8(2)

DRB

BQZ

OPA2333

DFN-8(2)

DRB

BQZ

(1) For the most current specification and package information see the Package Option Addendum at the end of this document, or see the TI web

site at www.ti.com.

(2) Available Q2 ’06.

PIN CONFIGURATIONS

1

2

3

5

4

V+

−IN

OUT

V

−

+IN

OPA333

SOT23−5

1

2

3

5

4

V+

OUT

+IN

V

−

−IN

OPA333

SC70−5

1

2

3

4

8

7

6

5

NC(1)

V+

OUT

NC(1)

−IN

+IN

V

−

OPA333

SO−8

1

2

3

4

8

7

6

5

V+

OUT B

−IN B

+IN B

OUT A

−IN A

+IN A

V

−

A

B

OPA2333

SO−8

1

2

3

4

8

7

6

5

V+

OUT B

−IN B

+IN B

OUT A

−IN A

+IN A

V

−

OPA2333

DFN−8

Exposed

Thermal

Die Pad

on

Underside(2)

(1) NC denotes no internal connection.

(2) Connect thermal die pad to V−.

(3) Available Q2 ’06.

(3)

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