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ULC0408FC33C Datasheet(PDF) 4 Page - Protek Devices |
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ULC0408FC33C Datasheet(HTML) 4 Page - Protek Devices |
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4 / 6 page 
4 www.protekdevices.com 05170.R5 4/05 ULC0408FC3.3C thru ULC0408FC36C Ramp-up Ramp-down Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down T S - Preheat T SMAX T SMIN T L t 25°C to Peak 30-60 seconds T P 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: T P for Lead-Free (SnAgCu): 260-265°C T P for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. APPLICATION INFORMATION |
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