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EMIF08-VID01C1 Datasheet(PDF) 4 Page - STMicroelectronics |
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EMIF08-VID01C1 Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 6 page 2 Ordering information scheme EMIF08-VID01C2 4/6 2 Ordering information scheme 3 Package mechanical data flip chip Figure 7. Marking Figure 8. Foot print receommendation EMI Filter Number of lines X: resistance (Ohms) Z: capacitance value / 10 pF or Application (3 letters) and Version (2 digits) C: Coated flip chip 1: Pitch = 500 µm, Bump = 315 µm 2: Lead free Pitch = 500 µm, Bump = 315 µm EMIF vv - xxx zz C y 695µm +/- 70 3.92 mm +/-50µm 500µm +/-50 315 µm +/- 50 250µm +/-50 695µm +/- 70 695µm +/- 70 3.92 mm +/-50µm 500µm +/-50 315 µm +/- 50 250µm +/-50 3.92 mm +/-50µm 500µm +/-50 500µm +/-50 315 µm +/- 50 250µm +/-50 ® xx z y ww E ® xx z y ww ® 240 365 xx z y ww E Dot, ST Logo xx = marking z = packaging location yww = date code Dimensions in Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter |
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