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D164DT90UF Datasheet(PDF) 9 Page - Advanced Micro Devices |
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D164DT90UF Datasheet(HTML) 9 Page - Advanced Micro Devices |
9 / 57 page May 26, 2004 Am29DL16xD 9 Special Package Handling Instructions Special handling is required for Flash Memory prod- ucts in molded packages (BGA, TSOP, SO, PLCC, PDIP). The package and/or data integrity may be com- prom is ed if the pac k age body is ex pos ed to temperatures above 150 °C for prolonged periods of time. A1 B1 C1 D1 E1 F1 G1 H1 A2 B2 C2 D2 E2 F2 G2 H2 A3 B3 C3 D3 E3 F3 G3 H3 A4 B4 C4 D4 E4 F4 G4 H4 A5 B5 C5 D5 E5 F5 G5 H5 A6 B6 C6 D6 E6 F6 G6 H6 DQ15/A-1 VSS BYTE# A16 A15 A14 A12 A13 DQ13 DQ6 DQ14 DQ7 A11 A10 A8 A9 VCC DQ4 DQ12 DQ5 A19 NC RESET# WE# DQ11 DQ3 DQ10 DQ2 NC A18 WP#/ACC RY/BY# DQ9 DQ1 DQ8 DQ0 A5 A6 A17 A7 OE# VSS CE# A0 A1 A2 A4 A3 48-Ball Very Thin Profile Fine-pitch BGA Top View, Balls Facing Down |
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