Preliminary Specification

PE42660

Page 7 of 9

Document No. 70-0192-02

©2005 Peregrine Semiconductor Corp. All rights reserved.

Table 6. Mechanical Specifications

Table 7. Pad Coordinates

All pad locations originate from the die center and refer to the

center of the pad.

All pad openings are 60 x 60 µm except for Pad #3 which is 140 x 60 µm.

Minimum pad pitch is 80 µm.

Note 1. - Double pad, requires two bond wires.

Figure 9. Pad Numbering

1.25 mm

1.21 mm

TX1

PE42660

Die

TX2

RX1

RX2

GND

GND

GND

GND

RX3

GND

GND

RX4

GND

1

2

3

4

5

6

7

8

9

10 11

12

13

14

15

16

17

18

19

20

Parameter

Minimum

Typical

Maximum

Units

Test Conditions

Die Size (x,y)

1.146 x 1.106

mm

As drawn

Die Size (x,y)

1.25 x 1.21

mm

Including excess sapphire, max. tolerance

= ±0.1mm in either dimension

Wafer Thickness

180

200

220

µm

Wafer Size

150

mm

Pad #

Pad Name

Pad Center (

X

Y

1

ANT

1.9

488.1

2

TX1

-511.3

491.3

3

-511.3

168.9

4

TX2

-511.3

-153.5

5

GND

-511.3

-233.5

6

GND

-511.3

-491.3

7

VDD

-337.7

-491.3

8

V3

25.7

-491.3

9

GND

160.9

-491.3

10

V2

296.1

-491.3

11

V1

376.1

-491.3

12

GND

511.3

-491.3

13

GND

511.3

-223.7

14

RX4

511.3

-105.1

15

GND

511.3

-25.1

16

RX3

511.3

93.5

17

GND

511.3

173.5

18

RX2

511.3

292.1

19

GND

511.3

372.1

20

RX1

511.3

490.7