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4304-00 Datasheet(PDF) 2 Page - Peregrine Semiconductor Corp. |
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4304-00 Datasheet(HTML) 2 Page - Peregrine Semiconductor Corp. |
2 / 11 page Product Specification PE4304 Page 2 of 11 ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0066-04 │ UltraCMOS™ RFIC Solutions Table 2. Pin Descriptions Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rate specified in Table 3. Exposed Solder Pad Connection The exposed solder pad on the bottom of the package must be grounded for proper device operation. Note 1: Both RF ports must be DC blocked with an external series capacitor or held at 0 VDC. 2: Latch Enable (LE) has an internal 100 k Ω resistor to V DD. 3: Connect pin 12 to GND to enable internal negative voltage generator. Connect pin 12 to VSS (-VDD) to bypass and disable internal negative voltage generator. 4. Place a 10 k Ω resistor in series, as close to pin as possible. Figure 3. Pin Configuration (Top View) Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. Switching Frequency The PE4304 has a maximum 25 kHz switching rate. Resistor on Pin 1 & 3 A 10 k Ω resistor on the inputs to Pin 1 & 3 (see Figure 5) will eliminate package resonance between the RF input pin and the two digital inputs. Specified attenuation error versus frequency performance is dependent upon this condition. 1 15 14 13 12 11 2 3 4 5 C16 RF1 Data Clock LE GND Vss/GND P/S RF2 C8 20-lead QFN 4x4mm Exposed Solder Pad Pin No. Pin Name Description 1 C16 Attenuation control bit, 16dB (Note 4). 2 RF1 RF port (Note 1). 3 Data Serial interface data input (Note 4). 4 Clock Serial interface clock input. 5 LE Latch Enable input (Note 2). 6 VDD Power supply pin. 7 PUP1 Power-up selection bit, MSB. 8 PUP2 Power-up selection bit, LSB. 9 VDD Power supply pin. 10 GND Ground connection. 11 GND Ground connection. 12 Vss/GND Negative supply voltage or GND connection(Note 3) 13 P/S Parallel/Serial mode select. 14 RF2 RF port (Note 1). 15 C8 Attenuation control bit, 8 dB. 16 C4 Attenuation control bit, 4 dB. 17 C2 Attenuation control bit, 2 dB. 18 GND Ground connection. 19 C1 Attenuation control bit, 1 dB. 20 C0.5 Attenuation control bit, 0.5 dB. Paddle GND Ground for proper operation Table 3. Absolute Maximum Ratings Table 4. Operating Ranges Symbol Parameter/Conditions Min Max Units VDD Power supply voltage -0.3 4.0 V VI Voltage on any input -0.3 VDD+ 0.3 V TST Storage temperature range -65 150 °C P IN Input power (50 Ω) +30 dBm VESD ESD voltage (Human Body Model) 500 V Parameter Min Typ Max Units VDD Power Supply Voltage 2.7 3.0 3.3 V IDD Power Supply Current 100 µA Digital Input High 0.7xVDD V Digital Input Low 0.3xVDD V Digital Input Leakage 1 µA Input Power +24 dBm Temperature range -40 85 °C |
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