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MIC21LV32 Datasheet(PDF) 5 Page - Microchip Technology |
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MIC21LV32 Datasheet(HTML) 5 Page - Microchip Technology |
5 / 50 page 2021 Microchip Technology Inc. DS20006513A-page 5 MIC21LV32 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† VIN to PGND ............................................................................................................................................... -0.3V to +40V VDD, OUTS, PG to AGND ............................................................................................................................. -0.3V to +6V PVDD to PGND.............................................................................................................................................. -0.3V to +6V EN to AGND..................................................................................................................................... -0.3V to (VIN + 0.3V) SW1, SW2, CSP1, CSP2 to PGND ................................................................................................. -0.3V to (VIN + 0.3V) BST1 to SW1, BST2 to SW2 .......................................................................................................................... -0.3V to 6V DH1 to SW1, DH2 to SW2 ..............................................................................................-0.3V to (VBSTX – VSWX + 0.3V) ILIM, FREQ, SS, RIP_INJ, FBS, DROOP, PG, CSH, NPI, APO, ONR to AGND ............................ -0.3V to (VDD + 0.3V) EXTVDD to AGND ...................................................................................................................................... -0.3V to +14V CSN1, CSN2, GFB, PGND to AGND......................................................................................................... -0.3V to +0.3V Maximum Junction Temperature (TJ).................................................................................................................... +150°C Storage Temperature (TS).......................................................................................................................-65°C to +150°C Lead Temperature (TLEAD).................................................................................................................................... +300°C ESD Rating(1)(HBM) ...............................................................................................................................................2000V ESD Rating (1)(MM).................................................................................................................................................200V Operating Ratings‡ Supply Voltage (VIN) ...................................................................................................................................... 4.5V to 36V PVDD, VDD Pin Voltage ................................................................................................................................. 4.5V to 5.5V OUTS Pin Voltage......................................................................................................................................... 0.6V to 5.5V EXTVDD Pin Voltage ........................................................................................................................................ 0V to 13V SW1, SW2, CSP1, CSP2 Pin Voltage.................................................................................................................0V to VIN ILIM, FREQ, SS, RIP_INJ, FBS, DROOP, PG, CSH, NPI, APO, ONR to AGND.............................................. 0V to VDD DL1, DL2 to AGND............................................................................................................................................ 0V to VDD DH1 to SW1, DH2 to SW2 ................................................................................................................................ 0V to VDD Enable Input Voltage (VEN) .................................................................................................................................0V to VIN Junction Temperature(2) (TJ) .................................................................................................................. -40°C to +125°C Note 1: Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF. 2: PD(MAX) = (TJ(MAX) – TA)/JA, where JA depends upon the printed circuit layout. † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not ensured to function outside its operating ratings. |
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