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ICS83026BGI-01LFT Datasheet(PDF) 11 Page - Integrated Circuit Systems

Part # ICS83026BGI-01LFT
Description  LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS83026BGI-01LFT Datasheet(HTML) 11 Page - Integrated Circuit Systems

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83026BMI-01
www.icst.com/products/hiperclocks.html
REV. A JANUARY 16, 2006
11
Integrated
Circuit
Systems, Inc.
ICS83026I-01
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
SCHEMATIC EXAMPLE
Figure 3 shows an application schematic example of ICS83026I-
01. The ICS83026I-01 CLK/nCLK input can directly accepts
various types of differential signal. In this example, the input is
driven by an LVDS driver. The ICS83026I-01 outputs are
VDDO
R1
43
LVDS
VDD
R4
100
VDD=3.3V
LVCMOS
Zo = 50 Ohm
R3
1K
C2
0.1u
3.3V
Zo = 50 Ohm
VDDO= 3.3V, 2.5V or 1.8V
Zo = 50 Ohm
U1
ICS83026I-01
1
2
3
4
8
7
6
5
VDD
CLK
nCLK
OE
VDDO
Q0
Q1
GND
LVCMOS
R2
43
C1
0.1u
VDD
Zo = 50 Ohm
FIGURE 3. ICS83026I-01 SCHEMATIC EXAMPLE
LVCMOS drivers. In this example, series termination approach
is shown. Additional termination approaches are shown in the
LVCMOS Termination Application Note.
TRANSISTOR COUNT
The transistor count for ICS83026I-0I is: 260
TABLE 5A.
θ
JA
VS
. AIR FLOW TABLE FOR 8 LEAD SOIC
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
128.5°C/W
115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
112.7°C/W
103.3°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
RELIABILITY INFORMATION
TABLE5B.
θ
JA
VS
. AIR FLOW TABLE FOR 8 LEAD TSSOP
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W


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