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H01N60 Datasheet(PDF) 4 Page - Hi-Sincerity Mocroelectronics

Part No. H01N60
Description  N-Channel Power Field Effect Transistor
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Maker  HSMC [Hi-Sincerity Mocroelectronics]
Homepage  http://www.hsmc.com.tw
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H01N60 Datasheet(HTML) 4 Page - Hi-Sincerity Mocroelectronics

   
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200502
Issued Date : 2005.03.01
Revised Date : 2005.09.28
Page No. : 4/5
H01N60I, H01N60J
HSMC Product Specification
TO-251 Dimension
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
a1
A
F
G
a2
K1
K
3
2
1
C
a1
M
L
Tab
H1
a2
A
B
C
D
E
a1
F
G
H
H1
K
J
a2
a2
K1
y2
y2
M
a1
y1
a1
y1
y1
I
Marking:
Control Code
Date Code
HI
01
Pb Free Mark
Pb-Free: "
. " (Note)
Normal: None
N6 0
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-251
Plastic Package
HSMC Package Code: I
DIM
Min.
Max.
A
6.35
6.80
C
4.80
5.50
F
1.30
1.70
G
5.40
6.25
H1
6.75
8.00
K
0.50
0.90
K1
0.40
0.90
L
0.90
1.50
M
2.20
2.40
a1
0.40
0.65
a2
-
*2.30
*: Typical, Unit: mm
3-Lead TO-251
Plastic Package
HSMC Package Code: I
Marking:
Control Code
Date Code
HI
01
Pb Free Mark
Pb-Free: "
. " (Note)
Normal: None
N
0
6
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
Min.
Max.
A
6.40
6.80
B
-
6.00
C
5.04
5.64
D-
*4.34
E
0.40
0.80
F
0.50
0.90
G
5.90
6.30
H-
*1.80
H1
-
*9.30
I
-
*16.10
J-
*0.80
K
-
0.96
K1
-
*0.76
M
2.20
2.40
a1
0.40
0.60
a2
2.10
2.50
y1
-
5o
y2
-
3o
*: Typical, Unit: mm


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