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PLL701-10 Datasheet(PDF) 3 Page - PhaseLink Corporation

Part No. PLL701-10
Description  Low EMI Spread Spectrum Multiplier IC (in Die or Package)
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Maker  PLL [PhaseLink Corporation]
Homepage  http://www.phaselink.com
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PLL701-10 Datasheet(HTML) 3 Page - PhaseLink Corporation

   
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PLL701-10
Low EMI Spread Spectrum Multiplier IC (in Die or Package)
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 www.phaselink.com Rev 09/20/04 Page 3
PIN/PAD DESCRIPTIONS
Name
Pin #
Pad #
Type
Description
XIN/FIN
1
22
I
Crystal input to be connected to fundamental parallel mode crystal.
(CL=20pF) or clock input.
XOUT/SD0
2
23
B
At power-up, this pin is acts as input pin to select the modulation
rate and is latched in. After the input sampling, it is used as crystal
output connector. 120k
Ω internal pull up resistor.
M2
3
28
I
Digital control input to select output frequency. 30k
Ω internal pull-
up.
M1
4
29
I
Digital control input to select output frequency. 30k
Ω internal pull-
up.
M0
5
30
I
Digital control input to select output frequency. 30k
Ω internal pull-
up.
SC0
6
34
I
Digital control input to select spread spectrum modulation.
30k
Ω internal pull-up.
SC1
7
35
I
Digital control input to select spread spectrum modulation.
30k
Ω internal pull-up.
SC2
8
1
I
Digital control input to select spread spectrum modulation.
30k
Ω internal pull-up.
SC3
12
12
I
Digital control input to select spread spectrum modulation.
30k
Ω internal pull-up.
FOUT
10
8
O
Modulated Clock Frequency Output. The frequency before
modulation is synthesized by multiplying the input frequency by 1X
to 8X, depending on SD(0:1) and SC(0:3).
OE
11
10
I
Output Enable. When low, Tri-states all outputs.
30k
Ω internal pull-up.
VDD
13
13,14,15
P
3.3V Power Supply.
REF/SD1
14
16
B
At power-up, this pin acts as input pin to select the modulation rate
and is latched in. After the input sampling, this pin provides a
buffered Reference Clock Output of the same frequency as the
crystal or clock input. 30k
Ω internal pull-up.
AVDD
15
17,18,19
P
3.3V Analog power supply.
GNDOSC
N/A
25
P
Ground for Oscillator circuitry.
GNDBUF
N/A
7
P
Ground for output buffer circuitry.
GND
9 and 16
4,5,6,20,21
P
Ground.
Notes: B – bi-directional pin; I – input pin; P – power supply/ground pin.
DIE SPECIFICATIONS
Name
Value
Size
104 x 69 mil
Reverse side
GND
Pad dimensions
80 micron x 80 micron
Thickness
10 mil


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