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CY7C0833V-100BBI Datasheet(PDF) 10 Page - Cypress Semiconductor

Part # CY7C0833V-100BBI
Description  FLEx18-TM 3.3V 32K/64K/128K/256K/512K x 18 Synchronous Dual-Port RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C0833V-100BBI Datasheet(HTML) 10 Page - Cypress Semiconductor

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PRELIMINARY
CY7C0837V
CY7C0830V/CY7C0831V
CY7C0832V/CY7C0833V
Document #: 38-06059 Rev. *K
Page 10 of 28
IEEE 1149.1 Serial Boundary Scan (JTAG)[20]
The FLEx18 family devices incorporate an IEEE 1149.1 serial
boundary scan test access port (TAP). The TAP controller
functions in a manner that does not conflict with the operation
of other devices using 1149.1-compliant TAPs. The TAP
operates using JEDEC-standard 3.3V I/O logic levels. It is
composed of three input connections and one output
connection required by the test logic defined by the standard.
Performing a TAP Reset
A reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This reset does not affect the operation of the
devices, and may be performed while the device is operating.
An MRST must be performed on the devices after power-up.
Performing a Pause/Restart
When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the
scan chain will output the next bit in the chain twice. For
example, if the value expected from the chain is 1010101, the
device will output a 11010101. This extra bit will cause some
testers to report an erroneous failure for the devices in a scan
test. Therefore the tester should be configured to never enter
the PAUSE-DR state.
Boundary Scan Hierarchy for 9-Mbit Device
Internally, the CY7C0833V have two DIEs. Each DIE contain
all the circuitry required to support boundary scan testing. The
circuitry includes the TAP, TAP controller, instruction register,
and data registers. The circuity and operation of the DIE
boundary scan are described in detail below. The scan chain
of each DIE are connected serially to form the scan chain of
the CY7C0833V as shown in Figure 3. TMS and TCK are
connected in parallel to each DIE to drive all TAP controllers
in unison. In many cases, each DIE will be supplied with the
same instruction. In other cases, it might be useful to supply
different instructions to each DIE. One example would be
testing the device ID of one DIE while bypassing the others.
Each pin of FLEx18 family is typically connected to multiple
DIEs. For connectivity testing with the EXTEST instruction, it
is desirable to check the internal connections between DIEs
as well as the external connections to the package. This can
be accomplished by merging the netlist of the devices with the
netlist of the user’s circuit board. To facilitate boundary scan
testing of the devices, Cypress provides the BSDL file for each
DIE, the internal netlist of the device, and a description of the
device scan chain. The user can use these materials to easily
integrate the devices into the board’s boundary scan
environment. Further information can be found in the Cypress
application note Using JTAG Boundary Scan For System in a
Package (SIP) Dual-Port SRAMs.
216 215
26
21
25
22
24 23
20
216 215
26
21
25
22
24 23
20
216 215
26
21
25
22
24 23
20
216 215
26
21
25
22
24 23
20
H
H
L
H
11
0s
1
0
1
0
1
01
00
Xs
1
X
0
X
0
X0
11
Xs
1
X
1
X
1
X1
00
Xs
1
X
0
X
0
X0
Masked Address
Unmasked Address
Mask
Register
bit-0
Address
Counter
bit-0
CNTINT
Example:
Load
Counter-Mask
Register = 3F
Load
Address
Counter = 8
Max
Address
Register
Max + 1
Address
Register
Figure 2. Programmable Counter-Mask Register Operation[1, 19]
Notes:
19. The “X” in this diagram represents the counter upper bits
20. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance


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