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XPC850DSLCZT50BU Datasheet(PDF) 8 Page - Motorola, Inc |
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XPC850DSLCZT50BU Datasheet(HTML) 8 Page - Motorola, Inc |
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8 / 76 page  8 MPC850 (Rev. A/B/C) Hardware Specifications MOTOROLA This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VCC). Table 4-3 provides the package thermal characteristics for the MPC850. Table 3-2. Maximum Ratings (GND = 0V) Rating Symbol Value Unit Supply voltage VDDH -0.3 to 4.0 V VDDL -0.3 to 4.0 V KAPWR -0.3 to 4.0 V VDDSYN -0.3 to 4.0 V Input voltage 1 1 Functional operating conditions are provided with the DC electrical specifications in Table 4-5. Absolute maximum ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage to the device. CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not be applied to its inputs). Vin GND-0.3 to VDDH + 2.5 V V Junction temperature 2 2 The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of the device. Tj 0 to 95 (standard) -40 to 95 (extended) ˚C Storage temperature range Tstg -55 to +150 ˚C |
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