3
Absolute Maximum Ratings
(No Derating Required up to 85
°C)
Storage Temperature ................................................. -55
°C to +125°C
Operating Temperature ............................................... -40
°C to +85°C
Average Input Current - IF ........................................................ 20 mA
Peak Input Current - IF .............................................................. 40 mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF .............................................. 1.0 A
(
≤1 µs pulse width, 300 pps)
Reverse Input Voltage - VR .............................................................. 5 V
Input Power Dissipation ........................................................... 35 mW
Output Current - IO (Pin 5) ........................................................ 60 mA
Supply and Output Voltage - VCC (Pin 6-4),VO (Pin 5-4)
HCPL-M700 ................................................................... -0.5 V to 7 V
HCPL-M701 ................................................................. -0.5 V to 18 V
Output Power Dissipation .....................................................................
Infrared and Vapor Phase Reflow Temperature .................. see below
Insulation Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap
L(IO1)
≥5
mm
Measured from input terminals
(Clearance)
to output terminals
Min. External Tracking Path
L(IO2)
≥5
mm
Measured from input terminals
(Creepage)
to output terminals
Min. Internal Plastic Gap
0.08
mm
Through insulation distance
(Clearance)
conductor to conductor
Tracking Resistance
CTI
175
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group (per DIN VDE 0109)
IIIa
Material Group DIN VDE 0109
Maximum Solder Reflow Thermal Profile.
(Note: Use of Non-Chlorine Activated Fluxes is Recommended.)
100 mW
240
∆T = 115°C, 0.3°C/SEC
0
∆T = 100°C, 1.5°C/SEC
∆T = 145°C, 1°C/SEC
TIME – MINUTES
220
200
180
160
140
120
100
80
60
40
20
0
260
12
3
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10
11
12
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